Thick Film Hybrid Circuit and Assembly
ISO9001 Certified
Our manufacturing facilities are ISO9001 certified and well equipped to
manufacture high quality thick film circuits in high-volume production in a short
lead time. Our 130,000 sq. ft. manufacturing facility, which includes a Class
100,000 and a Class 10,000 clean room area, is well
equipped to supply thick film hybrid circuits and assembly to a broad
cross-section of the electronics industry. Examples of our manufactured products are: chip
resistors, attenuators, frequency converters, DC/DC and AC/DC converting modules,
interface integrated circuits for telephone exchangers, oscillators, solid state
relays, microwave thick film circuits, thick film heaters and contract assembly.
We can assist you in the design and production of custom thick film hybrid
circuits, and provide low cost and quick-turnaround
manufacturing for quantities ranging from prototype to millions of pieces.
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We help build our customer's success by
supplying
premium quality thick film hybrid circuits at a low cost with on-time
delivery. Our manufacturing is very flexible and can provide for different
requirement ranging
from single layer to multilayer hybrid circuits. The cutting edge technology
of our manufacturing can always meet customer design needs for hybrid circuitry.
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E-TekNet's experienced design engineers and customer service
specialists are here to provide enhanced customer service and assist you with
your product needs. We cooperate with you on your designs and work together with
you on your engineering challenges.
Custom Thick Film
Hybrid Circuits
 Full in-house design and
prototype capability for customer designs
Production from small to
mass quantity
From single layer up to
8 layers
DuPont inks as standard,
Other inks available
Multi-layer
metallization
Manufacturing thick film
resistors on ceramic substrate
Printing tight absolute
resistor tolerances down to 0.5% and 0.1% (ratio) or better
Temperature coefficient
of resistance (TCR) 100 ppm or better
Thick film resistance
range: 0.1 ohm to 1,000 Mohm
Minimum conductor width:
0.004"
Maximum size of hybrid
substrate: 5"x4"
Minimum size of hybrid
substrate: 0.08"x0.08"
Custom-developed
functional testing to fully meet customer requirements
Combination of Hybrid
and SMT
Conductor materials:
PtAu, PtAg, PdAg, Au, Ag, PtPdAg
Package: Resin coating,
polyester paint coating
Substrate: 96% alumina,
AlN, and BeO
Active laser trimming to
further increase resistance accuracy
Automated Assembly
Die and wire bonding
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